Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer
Thank you Tsvetan Usunov
Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan
this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Thu Feb 11 07:24:40 EST 2016 | truewanderer
I'm planning to design the pcb of my project. The controller used is having 136 pins and the package is P-LFBGA. So i think i need to design a 6 layer board for better performance. I haven't designed a multi layer board before. So what are things tak
Electronics Forum | Thu Sep 09 04:45:02 EDT 2004 | Rob
Hi, Depends on where in the world you're based, but in the UK you can pick up a decent Universal GSM1 for around �12K-�15K ($20K-$27K). We place BGA's, huge fine pitch IC's, 72mm connectors etc with no problem. I believe they do up to 100mm feeder
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Wed Sep 08 22:13:07 EDT 2004 | Frank
Our Juki KE-2020 can place up to 74mm X 74mm ICs and BGA. I am have placed this zif socket before on the KE-2020 that you are speaking of. I don't think the KE-2020s are being made any longer. I know the new KE-2060 machines (that replaced the KE-
Electronics Forum | Thu Jul 15 12:09:10 EDT 2010 | wrongway
if the BGA has leaded balls use leaded paste if the BGA has lead free balls use lead free paste and set your oven profile to match the paste
Electronics Forum | Mon Jul 12 16:33:10 EDT 2010 | davef
Ideas to follow are: * Review IPC-7095 BGA Process Implementation * Look here: http://www.smtinfo.net/Db/_Ball%20Grid%20Arrays.html
Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders
I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o
